Yɛbɔ mmɔden wɔ nneɛma a ɛkorɔn-nneɛma a yɛde ma mu OEM ne ODMano aduru ma yɛn ahokafo, .

denam mfiridwuma a ɛyɛ foforo-a ɛyɛ adwuma ne nneɛma a wɔyɛ ho nimdeɛ a wotumi sesa so.

Ground backing board yɛ board a wɔabom ayɛ a wɔayɛ no titiriw ama nsuo a ɛmma nsuo ntumi nkɔ mu ne nea wɔde siw ɔdan fam ano. Ne ade titiriw no yɛ high-density XPS extruded polystyrene foam, a wɔahyɛ no den wɔ afã abien no nyinaa denam alkali-resistant high-ahoɔden nhama. Ɛyɛ hare, ɛyɛ adwuma pii, na ɛtra hɔ kyɛ. Nneɛma titiriw no de XPS extruded polystyrene board a ɛkorɔn-density a ɛwɔ closed-cell rate boro 99.8% na edi dwuma. Saa ɛwoɔ-te sɛ nkwammoaa a wɔato mu-nkwaboaa nhyehyɛe yi siw nsuo a ɛkɔ mu wɔ fibea no ano yie, berɛ a ɛsan nso ma nsuo a ɛbɔ ho ban a ɛyɛ den ne mfiri mmoa. Alkali-resistant high-ahoɔden nhama no ma board no mpaapaemu ne interfacial adhesion ahoɔden yɛ kɛse, na esiw detachment bere a edi hɔ adansi. Polymer nano-quartz composite coating a ɛwɔ soro no ma ade no nya nsu a ɛrentumi nkɔ mu, ɛko tia, na ɛko tia wim tebea-.

Ground backing board, sɛ industrial-grade adansi ade, di nnwuma gyinapɛn ahorow so ma ne adwumayɛ ho nsɛnkyerɛnne.

Nsuo ne nsuo ntumi nkɔ mu-adanseɛ: Nsuo a ɛtwetwe nnɔnhwereɛ 96 Nsuo a ɛtwetwe nsuo a ɛnnu anaasɛ ɛne no yɛ pɛ 1.0%, ɛba fam koraa sene 15% a ɛwɔ semɛnte a wɔde ayɛ atetesɛm mu, na ɛma ɛyɛ den wɔ mmeaeɛ a ɛhɔ yɛ nwini mpo wɔ berɛ tenten mu.
Ɔhyew a wɔde siw ano: Ɔhyew a ɛkɔ λ Ennu anaasɛ ɛne 0.034W/(m・K) yɛ pɛ, na ɛtew ɔhyew a ɛyera wɔ dan mu no so kɛse.
Mfiridwuma su: Ahoɔden a wɔde mia no boro 350kPa, ahoɔden a ɛbɔ boro 150kPa, ɛtumi gyina adesoa a wɔakyekyɛ no pɛpɛɛpɛ a ɛyɛ 200kg/MMI ano, na ɛdi fam adesoa-soa ahwehwɛdeɛ a ɛwɔ adan a wɔte mu ne aguadidan mu no ho dwuma.
Nneɛma a atwa yɛn ho ahyia ho banbɔ ne ahobammɔ: Nneɛma a wɔde yɛ ade no du nnwuma gyinapɛn ahorow ho, na ɛma ɛfata sɛ wɔde di dwuma wɔ mmeae a mframa pa ho ahwehwɛde a ɛkorɔn te sɛ afie, sukuu ahorow, ne ayaresabea ahorow.

Sɛ wɔde toto atetesɛm mu nkabom a ɛne semɛnte leveling + nsuo ntumi nkɔ mu membrane + ahobammɔ layer ho a, asase akyi board no da adwumayɛ a ɛkorɔn kɛse adi.

Nea emu yɛ hare na ɛyɛ adwuma yiye

Sɛ wɔde toto semɛnte a wɔde di dwuma wɔ amanne kwan so no mu duru ho a, ɛyɛ hare, na ɛma adesoa a ɛwɔ ɔdan no so no so tew na ɛmma wonhia sɛ wɔde adansi mfiri a emu yɛ duru di dwuma, na ɛnam so ma adansi no tu mpɔn.

Seamless nsuo a ɛyɛ den

Sɛ wɔde splicing one-piece molded panels no a, sealant soronko nkutoo na ehia wɔ joints no so, a ɛtew asiane a ɛwɔ leakage mu kɛse sɛ wɔde toto atetesɛm roll materials ho a.

Nneɛma pii a wɔde bom yɛ adwuma

Ebetumi ayɛ nnwuma pii bere koro mu te sɛ nsu a wɔde siw ano, ɔhyew a wɔde siw ano, nea wɔde hyɛ mu, ne nnyigyei a wɔde siw ano, na ɛtew akwan horow pii so na ɛtew adansi ho ka nyinaa so;

Ɛtena hɔ kyɛ-na ɛtra hɔ kyɛ

Ɛwɔ bere tenten a wɔde yɛ adwuma, na ɛtew ɛka a wɔbɔ wɔ nsiesie ne nea wɔde besi ananmu wɔ akyiri yi mu no so.